Showing results: 16 - 30 of 104 items found.
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iWave Systems Technologies
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
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GT9000P-USB3 -
Guide Technology, Inc.
A 2 channel Portable “CTIA” and/or “TIC” Test Platform controlled by USB3
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GT9000 -
Guide Technology, Inc.
GT9000 is a scalable 2 to 10 channelsBench-Top CTIA and/or TIC Test Platformwith 10” touch-screen-display (iPhone quality), integrated GUI with Touch, Ethernet, WiFi and/or wireless keyboard & mouse.
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GT9000R -
Guide Technology, Inc.
GT9000R is a scalable 2 to 24 channels 19”Rack-Mount CTIA and/or TIC Test Platformwith integrated GUI, Ethernet, Wi-Fi and/orwireless keyboard & mouse.
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UF3000EX-e -
CSE Co.,Ltd
Wafer Probe Station is used in connection with test system in Wafer Test process.It is a device to move wafer automatically to examine fair quality of individual chip on the wafer. Probe Station is seperated depending on purpose. For analysis, for mass production as well as manual, semi-automatic, full-automatic.
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Tokyo Seimitsu Co., Ltd.
Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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ipTEST Limited
ipTEST now offers a range of multi-prober test systems with increased productivity and increased capability for power discrete wafer testing. Perform power discrete wafer testing and Known Good Die (KGD) tests.
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NorCom 2020-WL -
NorCom Systems Inc.
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Precio octo -
Tokyo Electron Ltd.
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Das Test Haus
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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RoodMicrotec GmbH
Tests regarding function, electrical and optoelectronical parameter. Electrical test of wafer up to 8? and packaged devices - selection and volume test.
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Amkor Technology, Inc.
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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MPI Photonics Automation
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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VS6845E -
Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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400SW -
Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection.